CHICAGO – PMMI, The Association for Packaging and Processing Technologies, recognized six scholarship recipients during PACK EXPO International.
The PMMI Foundation awarded $30,000 in total to the students, who are attending schools that are part of PMMI’s education partners program.
“PMMI remains committed to supporting students enrolled at PMMI education partners and investing in the future packaging and processing workforce,” said Jim Pittas, PMMI’s president and chief executive officer. “Fundraising events such as PACK gives BACK provide critical resources to help our industry advance. We are thankful for the generosity of our sponsors, partners and attendees who help drive our industry forward.”
The foundation granted each of the following students a $5,000 individual PACK EXPO Scholarship:
• Morgan Bartholomew - Pennsylvania College of Technology
• Katelynn Chavez - Rutgers University
• Brandon Coleman - Michigan State University
• Caroline Joseph - Clemson University
• Sarvesh Kinariwala - Rochester Institute of Technology
• Maribel Morales - California Polytechnic State University- San Luis Obispo
PACK EXPO Scholarship applicants must attend an institution that is a PMMI education partner, have a grade point average of 3.0 or higher, major in engineering, packaging, processing, mechatronics or a related field, and “demonstrate a commitment to the industry.”
PMMI’s foundation each year awards more than $200,000 in academic scholarships as a way to bolster the workforce for the packaging and processing industries.